My main research area in interest on RMST project is ââ¬ËMicro-fluidic and Lab on a chip Technologyââ¬â¢. I am concentrating on the research for the development of technologies involves fabrication of micro-structure (micro-electrodes) and micro-fluidic polymeric devices. In addition, I am also concentrating on technologies for hot embossing process (HE) on polymers (e.g. COC, COP, PMMA etc) for creating micro-fluid structure and aligned bonding techniques to seal micro-devices.High aspect ratio silicon (Si) mould master is fabricated with micro-fluidic structure using deep reactive ion etched technique (DRIE) to create Ni master using electro-form technique to emboss microfluidic structure on polemers.
Figure 1 shows a Si mould master with micro-fluidic structure. This mould is used for Ni electro-plating. Figure 2 shows a embossed micro-fluidic channel on zeonox 690R COC (Tg 136ðC )using Ni stamp.