The University of Southampton
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Electronics and Computer Science
Telephone:
+442380592270
Email:
T.Mak@soton.ac.uk

Dr Terrence Mak PhD, DIC, SMIEEE, MIET

Personal homepage
https://www.researchgate.net/profile/Terrence_Mak
https://scholar.google.co.uk/citations?user=TdSU6G8AAAAJ&hl=en
https://www.linkedin.com/in/terrencemak/?originalSubdomain=uk

Terrence Mak is an Associate Professor at Electronics and Computer Science, University of Southampton, UK. Supported by the Royal Society, he was a Visiting Scientist at MIT during 2010, and also, affiliated with the Chinese Academy of Sciences as a Visiting Professor since 2013. Previously, he was supervised by Prof. Ivan Sutherland (Turing Award holder), at Sun Labs in California and he has awarded Croucher Foundation Scholarship for studying his PhD. A quote from him, "Looking into the future and applying your imagination, connections begin to appear", he led his research team make significant contributions to the research areas including computer architecture design, optimisation and adaptation for VLSI systems, network-on-chip, 3D-IC and, lately, wireless-on-chip. Throughout a spectrum of publications, he has awarded six Best Paper Awards, and one nominated, from prestigious conferences, at EMBS’05, DATE’11, VLSI-SoC’14, PDP’15, EUC 2016, DATE’18 (nominated) and ISPLED’19. He has granted two US patents of his engineering designs, i.e. US16/685,090 and US13/638,330. He was also awarded the IET Premium Yearly Best Paper Award for Computer & Digital Techniques in 2013. More recently, his newly published journal based on 3D-IC has awarded the prestigious 2015 IET Computers & Digital Techniques Premium Award. His publication at IEEE Transactions has been selected as “Top 25 Downloaded Manuscript” in 2015. He has published more than 150 papers in both conferences and journals and jointly published 4 books.

Research

Research interests

  1. VLSI design
  2. Computer architectures design
  3. Circuit design using FPGA
  4. Network-on-chip
  5. 3D-IC and Wireless-on-Chip commununication

Teaching

  1. Computer architectures
  2. Design, implementation and evaluation Using FPGA
  3. System-on-Chip system design and evaluation

Publications

Dehir, Nizar, Mak, Terrence, Fei, Xia and Alex, Yakovlev (2014) Modeling and tools for power supply variations analysis in networks-on-chip. IEEE Transactions on Computers, 63 (3), 679-690. (doi:10.1109/TC.2012.272).

Tarawneh, Gareth, Yakovlev, Alex and Mak, Terrence (2014) Eliminating synchronization latency using sequenced latching. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 22 (2), 408-419. (doi:10.1109/TVLSI.2013.2243177).

Dahir, Nizar, Al-Dujaily, Ra'ed, Mak, Terrence and Yakovlev, Alex (2014) Thermal optimization in network-on-chip-based 3D chip multiprocessors using dynamic programming networks. [in special issue: Real-Time and Embedded Technology and Applications, Domain-Specific Multicore Computing, Cross-Layer Dependable Embedded Systems, and Application of Concurrency to System Design (ACSD'13)] ACM Transactions on Embedded Computing Systems, 13 (4s), 139/1-139/25, [139]. (doi:10.1145/2584668).

AL-DUJAILY, RAAED, Li, An, Maunder, Robert, Mak, Terrence, Al-Hashimi, Bashir and Hanzo, Lajos (2016) A Scalable Turbo Decoding Algorithm for High-Throughput Network-on-Chip Implementation. University of Southampton doi:10.5258/SOTON/397738 [Dataset]

Karkar, Ammar, Mak, Terrence, Tong, Kin-Fai and Yakolev, Alex (2016) A survey of emerging interconnects for on-chip efficient multicast and broadcast in many-cores. IEEE Circuits and Systems Magazine, 16 (1), 58-72. (doi:10.1109/MCAS.2015.2510199).

Opoku Agyeman, M., Vien, Q., Ahmadinia, Ali, Yakovlev, A., Tong, K. and Mak, T. (2017) A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design. IEEE Transactions on Parallel and Distributed Systems, 28 (2), 359-373. (doi:10.1109/TPDS.2016.2575836).

Karkar, A., Mak, T., Tong, K. and Yakovlev, A. (2016) Network-on-chip multicast architectures using hybrid wire and surface-wave interconnects. IEEE Transaction on Emerging Topics in Computing, 1-12. (doi:10.1109/TETC.2016.2551043).

Ng, J., Singh, A., Wang, X. and Mak, T. (2016) Defragmentation for efficient runtime resource management in NoC-based many-core systems. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24 (11), 3359-3372. (doi:10.1109/TVLSI.2016.2548564).

Wang, X., Zhao, B., Wang, L., Mak, T., Yang, M. and Daneshtalab, M. (2016) A pareto-optimal runtime power budgeting scheme for many-core systems. Microprocessors and Microsystems, 46, part B, 136-148. (doi:10.1016/j.micpro.2016.03.006).

Fei, T., Wang, X., Zhang, B. and Mak, T. (2016) On runtime adaptive tile defragmentation for resource management in many-core systems. Microprocessors and Microsystems, 46, part B, 161-174. (doi:10.1016/j.micpro.2016.02.004).

Wang, X., Zhao, B., Mak, T., Yang, M., Jiang, Y. and Daneshtalab, M. (2016) On fine-grained runtime power budgeting for networks-on-chip systems. IEEE Transactions on Computers, 65 (9), 2780-2793. (doi:10.1109/TC.2015.2506565).

Liu, Q., Ji, W., Chen, Q. and Mak, T. (2016) IP protection of mesh NoCs using square spiral routing. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 24 (4), 1560-1573. (doi:10.1109/TVLSI.2015.2462842).

Agyeman, M., Tong, K. and Mak, T. (2015) An improved wireless communication fabric for emerging Network-on-Chip design. [in special issue: The 10th International Conference on Future Networks and Communications (FNC 2015) / The 12th International Conference on Mobile Systems and Pervasive Computing (MobiSPC 2015) Affiliated Workshops] Procedia Computer Science, 56, 415-420. (doi:10.1016/j.procs.2015.07.229).

Yi, W., Lo, K., Mak, T., Leung, K., Leung, Y. and Meng, H. (2015) A survey of wireless sensor network based air pollution monitoring systems. Sensors, 15 (12), 31392-31427. (doi:10.3390/s151229859).

Wang, X., Zhao, B., Mak, T., Yang, M. and Daneshtalab, M. (2015) An efficient runtime power allocation scheme for many-core systems inspired from auction theory. Integration the VLSI Journal, 50, 147-157. (doi:10.1016/j.vlsi.2014.11.001).

Luo, R., Coapes, G., Mak, T., Tadashi, Y., Degena, P. and Tin, C. (2016) Real-time simulation of passage-of-time encoding in cerebellum using a scalable FPGA-based system. IEEE Transactions on Biomedical Circuits and Systems, 10 (3), 742-753. (doi:10.1109/TBCAS.2015.2460232). (PMID:26452290)

Al-Dujaily, Ra'ed, Li, An, Maunder, Robert G, Mak, Terrence, Al-Hashimi, Bashir M. and Hanzo, Lajos (2016) A scalable turbo decoding algorithm for high-throughput network-on-chip implementation. IEEE Access, 1-1. (doi:10.1109/ACCESS.2016.2628801).

Wang, Xiaohang, Singh, Amit, Li, Bing, Yang, Yang, Li, Hong and Mak, Terrence (2018) Bubble budgeting: throughput optimization for dynamic workloads by exploiting dark cores in many core systems. IEEE Transactions on Computers, 67 (2), 178-192. (doi:10.1109/TC.2017.2735967).

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2017) Dataset supporting the paper entitled “A High-Speed Design Methodology for Inductive Coupling Links in 3D-ICs”. University of Southampton doi:10.5258/SOTON/D0312 [Dataset]

Fletcher, Benjamin, James, Das, Shidhartha, Poon, Chi-Sang and Mak, Terrence (2017) Dataset supporting the paper entitled “Low-Power 3D Integration using Inductive Coupling Links for Neurotechnology Applications". University of Southampton doi:10.5258/SOTON/D0318 [Dataset]

Wang, Ling and Mak, Terrence (2018) A Fault-Tolerant Routing Algorithm Using Tunnels in Fault Blocks for Network-on-Chip. Journal of Circuits, Systems and Computers, 27 (2), [1850022]. (doi:10.1142/S0218126618500226).

Fletcher, Benjamin J., Das, Shidhartha and Mak, Terrence (2018) A high-speed design methodology for inductive coupling links in 3D-ICs. In 2018 Design, Automation and Test in Europe Conference and Exhibition (DATE). vol. 2018-January, IEEE. pp. 497-502 . (doi:10.23919/DATE.2018.8342059).

Fletcher, Benjamin James, Das, Shidhartha, Poon, Chi-Sang and Mak, Terrence (2018) Low-power 3D integration using inductive coupling links for neurotechnology applications. Design Automation and Test in Europe, , Dresden, Germany. 19 - 23 Mar 2018. 6 pp .

Wang, Liang, Wang, Xiaohang, Leung, Ho Fung and Mak, Terrence (2018) Runtime task mapping for lifetime budgeting in many-core systems. In FDL 2017 - Proceedings of the 2017 Forum on Specification and Design Languages. vol. 2017-September, IEEE Computer Society. pp. 1-8 . (doi:10.1109/FDL.2017.8303900).

Mak, Terrence, Matsutani, Hiroki and Pande, Partha Pratim (2018) Special session on bringing cores closer together: the wireless revolution in on-chip communication. In Proceedings - 2018 IEEE 36th VLSI Test Symposium, VTS 2018. vol. 2018-April, IEEE Computer Society Press. p. 1 . (doi:10.1109/VTS.2018.8368638).

Long, Zijun, Wang, Xiaohang, Jiang, Yingtao, Cui, Guofeng, Zhang, Li and Mak, Terrence (2018) Improving the efficiency of thermal covert channels in multi-/many-core systems. In Proceedings of the 2018 Design, Automation and Test in Europe Conference and Exhibition, DATE 2018. vol. 2018-January, Institute of Electrical and Electronics Engineers Inc. pp. 1459-1464 . (doi:10.23919/DATE.2018.8342241).

Leung, Yee, Leung, Kwong Sak, Wong, Man Hong, Mak, Terrence, Cheung, Kwan Yau, Lo, Leung Yau, Yi, Wei Ying and Dong, Yuan Lin (2018) An integrated web-based air pollution decision support system – a prototype. International Journal of Geographical Information Science, 32 (9), 1787-1814. (doi:10.1080/13658816.2018.1460752).

Wang, Liang, Wang, Xiaohang, Leung, Ho Fung and Mak, Terrence (2018) A non-minimal routing algorithm for aging mitigation in 2D-mesh NoCs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. (doi:10.1109/TCAD.2018.2855149).

Wang, Liang, Lv, Ping, Liu, Leibo, Han, Jie, Leung, Ho Fung, Wang, Xiaohang, Yin, Shouyi, Wei, Shaojun and Mak, Terrence (2018) A lifetime reliability-constrained runtime mapping for throughput optimization in many-core systems. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. (doi:10.1109/TCAD.2018.2855168).

Zhang, Li, Wang, Xiaohang, Jiang, Yingtao, Yang, Mei, Mak, Terrence and Singh, Amit Kumar (2018) Effectiveness of HT-assisted sinkhole and blackhole denial of service attacks targeting mesh networks-on-chip. Journal of Systems Architecture, 89, 84-94. (doi:10.1016/j.sysarc.2018.07.005).

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2018) Dataset supporting the article entitled "Design and Optimisation of Inductive Coupling Links for 3D-ICs". University of Southampton doi:10.5258/SOTON/D0707 [Dataset]

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2018) Dataset supporting the article entitled "CoDAPT: A Concurrent Data And Power Transceiver for Fully Wireless 3D-ICs". University of Southampton doi:10.5258/SOTON/D0728 [Dataset]

Yang, Shufan, Wong-Lin, Kong Fatt, Andrew, James, Mak, Terrence and McGinnity, T. Martin (2018) A neuro-inspired visual tracking method based on programmable system-on-chip platform. Neural Computing and Applications, 30 (9), 2697-2708. (doi:10.1007/s00521-017-2847-5).

Ding, Qian, Fletcher, Benjamin J. and Mak, Terrence (2018) Globally Wireless Locally Wired (GloWiLoW): A clock distribution network for many-core systems. In 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 - Proceedings. vol. 2018-May, Institute of Electrical and Electronics Engineers Inc.. (doi:10.1109/ISCAS.2018.8351041).

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2018) Cost-effective 3D integration using inductive coupling links: Can we make stacking silicon as easy as stacking Lego? Arm Research Summit 2018, Robinson College, Cambridge, United Kingdom. 17 - 19 Sep 2018.

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2019) CoDAPT: a concurrent data and power transceiver for fully wireless 3D-ICs. In 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE. 6 pp . (doi:10.23919/DATE.2019.8714863).

Fletcher, Benjamin J., Das, Shidhartha and Mak, Terrence (2019) Design and optimization of inductive-coupling links for 3-D-ICs. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 27 (3), 711-723. (doi:10.1109/TVLSI.2018.2881075).

Zhao, Yiming, Wang, Xiaohang, Jiang, Yingtao, Mei, Yang, Singh, Amit Kumar and Mak, Terrence (2019) On a new hardware Trojan attack on power budgeting of many core systems. Stan, Mircea, Sridhar, Ramalingam, Bhatia, Karan, Alioto, Massimo and Li, Helen (eds.) In Proceedings - 31st IEEE International System on Chip Conference, SOCC 2018. vol. 2018-September, IEEE Computer Society. pp. 90-95 . (doi:10.1109/SOCC.2018.8618565).

Ding, Q. and Mak, T. (2019) Hybrid interconnect network for on-chip low-power clock distribution. Electronics Letters, 55 (5), 244-246. (doi:10.1049/el.2018.6570).

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2019) Dataset supporting the article entitled "A Low-Energy Inductive Transceiver using Spike-Latency Encoding for Wireless 3D Integration". University of Southampton doi:10.5258/SOTON/D0949 [Dataset]

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2019) A low-energy inductive transceiver using spike-latency encoding for wireless 3D integration. In ACM/IEEE International Symposium on Low Power Electronics and Design : ISLPED 2019. 6 pp . (doi:10.1109/ISLPED.2019.8824866).

Xiao, Siyuan, Wang, Xiaohang, Palesi, Maurizio, Singh, Amit Kumar and Mak, Terrence (2019) ACDC: An accuracy- and congestion-aware dynamic traffic control method for networks-on-chip. In 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE. pp. 630-633 . (doi:10.23919/DATE.2019.8715189).

Fletcher, Benjamin, James, Das, Shidhartha and Mak, Terrence (2019) A 10.8pJ/bit pulse-position inductive transceiver for low-energy wireless 3D integration. In IEEE European Solid-State Circuits Conference (ESSCIRC). vol. 49, IEEE. 4 pp .

Gao, Weidong, Mak, Terrence and Yang, Lie Liang (2019) Type-spread molecular communications: principles and inter-symbol interference mitigation. In 2019 IEEE International Conference on Communications, ICC 2019 - Proceedings. vol. 2019-May, IEEE. pp. 1-6 . (doi:10.1109/ICC.2019.8761545).

Li, Bing, Wang, Xiaohang, Singh, Amit Kumar and Mak, Terrence (2019) On Runtime Communication and Thermal-Aware Application Mapping and Defragmentation in 3D NoC Systems. IEEE Transactions on Parallel and Distributed Systems, 30 (12), 2775-2789, [8733089]. (doi:10.1109/TPDS.2019.2921542).

Fletcher, Benjamin James, Das, Shidhartha and Mak, Terrence (2020) A spike-latency transceiver with tuneable pulse control for low-energy wireless 3D integration. IEEE Journal of Solid State Circuits, 55 (9), 2414-2428, [9086615]. (doi:10.1109/JSSC.2020.2989543).

Fletcher, Benjamin James, Mak, Terrence and Das, Shidhartha (2020) A 3D-stacked cortex-M0 SoC with 20.3Gbps/mm2 7.1mW/mm2 simultaneous wireless inter-tier data and power transfer. In Proceedings of 2020 IEEE Symposium on VLSI Circuits. (In Press)

Contact

Telephone: +44 (0) 23 8059 2270

Email: T.Mak@soton.ac.uk

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